NXP Semiconductors - BLM6G10-30G,118

BLM6G10-30G,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BLM6G10-30G,118
Description BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;
Datasheet BLM6G10-30G,118 Datasheet
In Stock4,674
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 28 V
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: BASEBAND CIRCUIT
Maximum Seated Height: 3.6 mm
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
No. of Functions: 1
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Length: 15.9 mm
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Peak Reflow Temperature (C): 245
Package Code: SOP
Width: 11 mm
Terminal Pitch: 1.37 mm
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
4,674 $36.840 $172,190.160

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