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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | BLM6G10-30G,118 |
| Description | BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN; |
| Datasheet | BLM6G10-30G,118 Datasheet |
| In Stock | 4,674 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
AMPNXPBLM6G10-30G,118 2156-BLM6G10-30G118-NXTR |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 28 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | BASEBAND CIRCUIT |
| Maximum Seated Height: | 3.6 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Length: | 15.9 mm |
| JESD-30 Code: | R-PDSO-G16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Peak Reflow Temperature (C): | 245 |
| Package Code: | SOP |
| Width: | 11 mm |
| Terminal Pitch: | 1.37 mm |
| Moisture Sensitivity Level (MSL): | 3 |









