NXP Semiconductors - BSC9131NXN1KHKB

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BSC9131NXN1KHKB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BSC9131NXN1KHKB
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 520; Package Code: FBGA; Package Shape: SQUARE;
In Stock2,624
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.97 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 520
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, FINE PITCH
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B520
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: FBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Speed: 1000 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 21 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
2,624 $61.920 $162,478.080

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