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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | BU1508AX |
| Description | NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 35 W; Maximum Collector Current (IC): 8 A; Maximum Power Dissipation Ambient: 35 W; |
| Datasheet | BU1508AX Datasheet |
| In Stock | 4,064 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Collector Current (IC): | 8 A |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Configuration: | SINGLE |
| Transistor Element Material: | SILICON |
| Transistor Application: | SWITCHING |
| Sub-Category: | Other Transistors |
| Surface Mount: | NO |
| No. of Terminals: | 3 |
| Maximum Power Dissipation (Abs): | 35 W |
| Terminal Position: | SINGLE |
| Package Style (Meter): | FLANGE MOUNT |
| Maximum Turn Off Time (toff): | 6600 ns |
| JESD-30 Code: | R-PSFM-T3 |
| No. of Elements: | 1 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 150 Cel |
| Case Connection: | ISOLATED |
| Maximum Power Dissipation Ambient: | 35 W |
| Polarity or Channel Type: | NPN |
| Minimum DC Current Gain (hFE): | 4 |
| Qualification: | Not Qualified |
| Maximum Collector-Emitter Voltage: | 700 V |
| Additional Features: | FORMED LEAD OPTIONS ARE AVAILABLE |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Maximum VCEsat: | 5 V |
