NXP Semiconductors - BU2523DF

BU2523DF by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BU2523DF
Description NPN; Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): 11 A; Transistor Application: SWITCHING; Package Shape: RECTANGULAR;
Datasheet BU2523DF Datasheet
In Stock70
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Collector Current (IC): 11 A
Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR
Transistor Element Material: SILICON
Transistor Application: SWITCHING
Polarity or Channel Type: NPN
Surface Mount: NO
Minimum DC Current Gain (hFE): 5
No. of Terminals: 3
Qualification: Not Qualified
Maximum Collector-Emitter Voltage: 800 V
Terminal Position: SINGLE
Package Style (Meter): FLANGE MOUNT
Maximum Turn Off Time (toff): 2300 ns
JESD-30 Code: R-PSFM-T3
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 150 Cel
Case Connection: ISOLATED
Maximum VCEsat: 5 V
Maximum Power Dissipation Ambient: 45 W
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