NXP Semiconductors - C3ENPB0-DS

C3ENPB0-DS by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number C3ENPB0-DS
Description MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 728; Package Code: HBGA; Package Shape: SQUARE;
Datasheet C3ENPB0-DS Datasheet
In Stock655
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Nominal Supply Voltage: 1.2 V
Integrated Cache: NO
Maximum Seated Height: 3.39 mm
Surface Mount: YES
No. of Terminals: 728
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 12
Technology: CMOS
JESD-30 Code: S-CBGA-B728
Maximum Clock Frequency: 180 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: HBGA
Width: 28.8 mm
Speed: 180 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.26 V
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 139
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Length: 28.8 mm
Terminal Pitch: 1 mm
Temperature Grade: AUTOMOTIVE
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Pricing (USD)

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