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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | C3ENPB0-DS |
Description | MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 728; Package Code: HBGA; Package Shape: SQUARE; |
Datasheet | C3ENPB0-DS Datasheet |
In Stock | 655 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.14 V |
Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
Nominal Supply Voltage: | 1.2 V |
Integrated Cache: | NO |
Maximum Seated Height: | 3.39 mm |
Surface Mount: | YES |
No. of Terminals: | 728 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 12 |
Technology: | CMOS |
JESD-30 Code: | S-CBGA-B728 |
Maximum Clock Frequency: | 180 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | HBGA |
Width: | 28.8 mm |
Speed: | 180 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.26 V |
Low Power Mode: | NO |
Boundary Scan: | YES |
External Data Bus Width: | 139 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Length: | 28.8 mm |
Terminal Pitch: | 1 mm |
Temperature Grade: | AUTOMOTIVE |