NXP Semiconductors - CBTD16212DL,112

CBTD16212DL,112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number CBTD16212DL,112
Description BUS EXCHANGER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet CBTD16212DL,112 Datasheet
In Stock433
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Output Characteristics: 3-STATE
Maximum Seated Height: 2.8 mm
Minimum Supply Voltage (Vsup): 4.5 V
Sub-Category: Other Logic ICs
Surface Mount: YES
No. of Terminals: 56
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G56
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: SSOP
Width: 7.5 mm
No. of Bits: 12
Output Polarity: TRUE
No. of Ports: 4
Logic IC Type: BUS EXCHANGER
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SSOP56,.4
Length: 18.425 mm
Propagation Delay (tpd): .25 ns
Nominal Supply Voltage / Vsup (V): 5
Family: CBT/FST/QS/5C/B
Peak Reflow Temperature (C): 260
Terminal Pitch: .635 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 5.5 V
Power Supplies (V): 5
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