NXP Semiconductors - CBTL06DP213EE,118

CBTL06DP213EE,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number CBTL06DP213EE,118
Description MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet CBTL06DP213EE,118 Datasheet
In Stock1,267
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.15 mm
No. of Inputs: 2
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Outputs: 1
No. of Terminals: 48
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-30 Code: S-PBGA-B48
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: TFBGA
Width: 5 mm
Moisture Sensitivity Level (MSL): 1
Output Polarity: COMPLEMENTARY
Packing Method: TR, 13 INCH
Logic IC Type: MULTIPLEXER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Length: 5 mm
Nominal Supply Voltage / Vsup (V): 3.3
Family: CBT/FST/QS/5C/B
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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Pricing (USD)

Qty. Unit Price Ext. Price
1,267 $1.740 $2,204.580

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