NXP Semiconductors - FXLC95000CLR1

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FXLC95000CLR1 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number FXLC95000CLR1
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 24; Package Code: TFLGA; Package Shape: RECTANGULAR;
In Stock14
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: 1.89 V
Maximum Seated Height: 1.1 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 24
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Length: 5 mm
Technology: CMOS
JESD-30 Code: R-PBGA-B24
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: TFLGA
Width: 3 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 3
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