HEC4066BD by NXP Semiconductors | Other Function Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	HEC4066BD
Description	SPST; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet	HEC4066BD Datasheet
In Stock	497

NAME	DESCRIPTION
Package Body Material:	CERAMIC, GLASS-SEALED
Width (mm):	7.62 mm
Maximum Seated Height:	5.08 mm
Maximum Switch-on Time:	30 ns
Nominal On-state Resistance Match:	5 ohm
Surface Mount:	NO
No. of Terminals:	14
Maximum On-state Resistance (Ron):	175 ohm
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	CMOS
JESD-30 Code:	R-GDIP-T14
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	125 Cel
No. of Channels:	1
Package Code:	DIP
Nominal Supply Voltage (Vsup):	15 V
Nominal Off-state Isolation:	50 dB
Maximum Switch-off Time:	140 ns
Nominal Negative Supply Voltage (Vsup):	0 V
Minimum Operating Temperature:	-55 Cel
No. of Functions:	4
Qualification:	Not Qualified
Other IC type:	SPST
Length:	19.43 mm
Terminal Pitch:	2.54 mm
Temperature Grade:	MILITARY

Pricing (USD)

Qty.	Unit Price	Ext. Price
497	-	-

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