NXP Semiconductors - HEF4093BPN

HEF4093BPN by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number HEF4093BPN
Description NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet HEF4093BPN Datasheet
In Stock920
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Schmitt Trigger: YES
Maximum Seated Height: 4.2 mm
No. of Inputs: 2
Minimum Supply Voltage (Vsup): 3 V
Sub-Category: Gates
Surface Mount: NO
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 14
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T14
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Propagation Delay At Nominal Supply: 185 ns
Width: 7.62 mm
Packing Method: BULK
Load Capacitance (CL): 50 pF
Logic IC Type: NAND GATE
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 4
Qualification: Not Qualified
Package Equivalence Code: DIP14,.3
Length: 19.025 mm
Propagation Delay (tpd): 185 ns
Nominal Supply Voltage / Vsup (V): 5
Family: 4000/14000/40000
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 15 V
Power Supplies (V): 5/15
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Pricing (USD)

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