NXP Semiconductors - HEF4519BPN

HEF4519BPN by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number HEF4519BPN
Description XNOR GATE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet HEF4519BPN Datasheet
In Stock3,129
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: 4.7 mm
No. of Inputs: 2
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: NO
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Width: 7.62 mm
Load Capacitance (CL): 50 pF
Logic IC Type: XNOR GATE
Minimum Operating Temperature: -40 Cel
No. of Functions: 4
Qualification: Not Qualified
Length: 21.6 mm
Propagation Delay (tpd): 190 ns
Nominal Supply Voltage / Vsup (V): 5
Additional Features: CONFIGURABLE AS QUAD 2:1 MUX
Family: 4000/14000/40000
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 15 V
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