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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | HTMS1101FUG/AM,026 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; No. of Functions: 1; |
| Datasheet | HTMS1101FUG/AM,026 Datasheet |
| In Stock | 3,905 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | WAFER |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| JESD-30 Code: | S-XUUC-N |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIE |
| Temperature Grade: | INDUSTRIAL |
