NXP Semiconductors - HTMS1301FUG/AM,005

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HTMS1301FUG/AM,005 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number HTMS1301FUG/AM,005
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
Datasheet HTMS1301FUG/AM,005 Datasheet
In Stock2,191
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: S-XUUC-N
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: DIE
Temperature Grade: INDUSTRIAL
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