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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | HTMS8001FTB/AF,115 |
Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Package Style (Meter): CHIP CARRIER; |
Datasheet | HTMS8001FTB/AF,115 Datasheet |
In Stock | 4,559 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Telecom IC Type: | TELECOM CIRCUIT |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
No. of Terminals: | 3 |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC3(UNSPEC) |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER |
Technology: | CMOS |
Terminal Form: | NO LEAD |
Peak Reflow Temperature (C): | 260 |
Package Code: | QCCN |
Moisture Sensitivity Level (MSL): | 1 |