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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | HTMS8001FTB/AF,115 |
| Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Package Style (Meter): CHIP CARRIER; |
| Datasheet | HTMS8001FTB/AF,115 Datasheet |
| In Stock | 4,559 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
568-14458-6 568-14458-2 568-14458-1 935290071115 HTMS8001FTB/AF,115-ND |
| Package Body Material: | PLASTIC/EPOXY |
| Telecom IC Type: | TELECOM CIRCUIT |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| No. of Terminals: | 3 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC3(UNSPEC) |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Technology: | CMOS |
| Terminal Form: | NO LEAD |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | QCCN |
| Moisture Sensitivity Level (MSL): | 1 |









