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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | HTSH5601ETK,118 |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR; |
| Datasheet | HTSH5601ETK,118 Datasheet |
| In Stock | 11,031 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
NXPNXPHTSH5601ETK,118 568-8621-6 HTSH5601ETK,118-ND 568-8621-2 HTSH5601ETK118 568-8621-1 2156-HTSH5601ETK,118 935279949118 |
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -25 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC2(UNSPEC) |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| JESD-30 Code: | R-PDSO-N2 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | SON |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 1 |
