NXP Semiconductors - ISP1362EE,557

ISP1362EE,557 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number ISP1362EE,557
Description BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet ISP1362EE,557 Datasheet
In Stock1,680
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.1 mm
Sub-Category: Bus Controllers
Surface Mount: YES
No. of Terminals: 64
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Address Bus Width: 2
Maximum Data Transfer Rate: 10 MBps
Technology: CMOS
JESD-30 Code: S-PBGA-B64
Maximum Clock Frequency: 12 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 6 mm
Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 16
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA64,10X10,20
Length: 6 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: SH-3; STRONGARM; XA; SPARCLITE; MIPS; ARM7; ARM9; DRAGONBALL; POWERPC
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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