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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | K32W032S1M2VPJAT |
Description | MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 176; Package Code: BGA; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY; |
Datasheet | K32W032S1M2VPJAT Datasheet |
In Stock | 437 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
ADC Channels: | YES |
No. of Terminals: | 176 |
DMA Channels: | YES |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | X-PBGA-B176 |
Package Shape: | UNSPECIFIED |
ROM Words: | 1310720 |
Terminal Form: | BALL |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Data EEPROM Size: | 0 |
Speed: | 72 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
RAM Bytes: | 393216 |
External Data Bus Width: | 0 |
Peripherals: | COMPARATOR(2); DMA(2); RTC; TEMPERATURE SENSOR; TIMER(30); WDT(3) |
Bit Size: | 32 |
DAC Channels: | YES |
JESD-609 Code: | e1 |
PWM Channels: | YES |
On Chip Program ROM Width: | 8 |
Additional Features: | IT HAS 12 BIT ADC AND 12 BIT DAC |
Connectivity: | I2C(4); SAI; SPI(4); UART(4); USB |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |