NXP Semiconductors - KXPC755CRX400LE

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KXPC755CRX400LE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number KXPC755CRX400LE
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
In Stock4,967
NAME DESCRIPTION
Package Body Material: CERAMIC
Speed: 400 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 64
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
No. of Terminals: 360
Qualification: Not Qualified
Package Equivalence Code: BGA360,19X19,50
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-XBGA-B360
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Terminal Pitch: 1.27 mm
Power Supplies (V): 2,2.5/3.3
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