NXP Semiconductors - LH79524

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LH79524 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LH79524
Description Other uPs/uCs/Peripheral ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: FBGA; Package Shape: SQUARE;
Datasheet LH79524 Datasheet
In Stock1,361
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 208
Qualification: Not Qualified
Package Equivalence Code: BGA208,16X16,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B208
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8,3.3
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