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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LH7A400N0E000B3A |
| Description | Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | LH7A400N0E000B3A Datasheet |
| In Stock | 3,679 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
LH7A400N0E000 425-1867 |
| Package Body Material: | CERAMIC |
| Sub-Category: | Other uPs/uCs/Peripheral ICs |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 256 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA256,16X16,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | S-XBGA-B256 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.8,3.3 |









