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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | LH7A404N0F000B3 |
Description | Other uPs/uCs/Peripheral ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | LH7A404N0F000B3 Datasheet |
In Stock | 574 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Other uPs/uCs/Peripheral ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 324 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA324,20X20,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
JESD-30 Code: | S-XBGA-B324 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | FBGA |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.8,3.3 |
Moisture Sensitivity Level (MSL): | 3 |