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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | LPC1114FDH28/102,5 |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR; |
Datasheet | LPC1114FDH28/102,5 Datasheet |
In Stock | 4,443 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.8 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
ADC Channels: | YES |
No. of Terminals: | 28 |
DMA Channels: | NO |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
No. of I/O Lines: | 21 |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G28 |
Maximum Clock Frequency: | 25 MHz |
Package Shape: | RECTANGULAR |
ROM Words: | 32768 |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TSSOP |
Width: | 4.4 mm |
Moisture Sensitivity Level (MSL): | 2 |
Data EEPROM Size: | 0 |
Speed: | 50 rpm |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 4096 |
External Data Bus Width: | 0 |
Peripherals: | BOD, POR, TIMER(5), WDT |
Bit Size: | 32 |
DAC Channels: | NO |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP28,.25 |
Length: | 9.7 mm |
PWM Channels: | NO |
On Chip Program ROM Width: | 8 |
Connectivity: | I2C, SPI, UART |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 6-Ch 10-Bit |
Terminal Pitch: | .65 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |
CPU Family: | CORTEX-M0 |