NXP Semiconductors - LPC1772FBD208

LPC1772FBD208 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC1772FBD208
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;
Datasheet LPC1772FBD208 Datasheet
In Stock4,344
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 100 rpm
Nominal Supply Voltage: 3.3 V
RAM Bytes: 24576
Sub-Category: Microcontrollers
Surface Mount: YES
Bit Size: 32
Maximum Supply Current: 100 mA
Minimum Operating Temperature: -40 Cel
No. of Terminals: 208
Qualification: Not Qualified
Package Equivalence Code: QFP208,1.2SQ,20
Terminal Position: QUAD
Package Style (Meter): FLATPACK
JESD-30 Code: S-PQFP-G208
Package Shape: SQUARE
ROM Words: 65536
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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