NXP Semiconductors - LPC1815JET100

LPC1815JET100 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC1815JET100
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet LPC1815JET100 Datasheet
In Stock1,298
NAME DESCRIPTION
Minimum Supply Voltage: 2.4 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.2 mm
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 100
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
No. of I/O Lines: 49
Address Bus Width: 14
Technology: CMOS
JESD-30 Code: S-PBGA-B100
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
ROM Words: 786432
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: TFBGA
Width: 9 mm
Moisture Sensitivity Level (MSL): 3
Data EEPROM Size: 16K
Speed: 180 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 139264
External Data Bus Width: 8
Peripherals: BOD, DMA(8), POR, RTC, TIMER(8), WDT
Bit Size: 32
DAC Channels: YES
Minimum Operating Temperature: -40 Cel
Digital To Analog Convertors: 1-Ch 10-Bit
Length: 9 mm
PWM Channels: NO
On Chip Program ROM Width: 8
Connectivity: C_CAN(2), I2C(2), I2S(2), IRDA, MMC, QEI, QSPI, SD, UART, USART(3)
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Analog To Digital Convertors: 4-Ch 10-Bit
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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