LPC1853FBD208,551 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	LPC1853FBD208,551
Description	Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;
Datasheet	LPC1853FBD208,551 Datasheet
In Stock	2,369

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Speed:	180 rpm
RAM Bytes:	139264
Sub-Category:	Microcontrollers
Surface Mount:	YES
Bit Size:	32
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	208
Qualification:	Not Qualified
Package Equivalence Code:	QFP208,1.2SQ,20
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK
JESD-30 Code:	S-PQFP-G208
Package Shape:	SQUARE
ROM Words:	524288
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	QFP
ROM Programmability:	FLASH
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2.5/3.3
CPU Family:	CORTEX-M3

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,369	-	-

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