NXP Semiconductors - LPC18S57JET256E

LPC18S57JET256E by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC18S57JET256E
Description MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet LPC18S57JET256E Datasheet
In Stock57
NAME DESCRIPTION
Minimum Supply Voltage: 2.4 V
Nominal Supply Voltage: 3.3 V
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 256
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
No. of I/O Lines: 164
Address Bus Width: 0
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Speed: 180 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 0
Bit Size: 32
Length: 17 mm
PWM Channels: YES
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
57 - -

Popular Products

Category Top Products