NXP Semiconductors - LPC2368FBD100,518

LPC2368FBD100,518 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC2368FBD100,518
Description Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
Datasheet LPC2368FBD100,518 Datasheet
In Stock438
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Microcontrollers
Surface Mount: YES
Terminal Finish: TIN SILVER
No. of Terminals: 100
Terminal Position: QUAD
Package Style (Meter): FLATPACK
JESD-30 Code: S-PQFP-G100
Package Shape: SQUARE
ROM Words: 524288
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Moisture Sensitivity Level (MSL): 3
Speed: 72 rpm
RAM Bytes: 59392
Bit Size: 32
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: QFP100,.63SQ,20
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
CPU Family: ARM7
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