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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LPC2458FET180-S |
| Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 180; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | LPC2458FET180-S Datasheet |
| In Stock | 169 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 25 rpm |
| Nominal Supply Voltage: | 3.3 V |
| RAM Bytes: | 100352 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Bit Size: | 32 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 180 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA180,14X14,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | S-PBGA-B180 |
| Package Shape: | SQUARE |
| ROM Words: | 524288 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
| CPU Family: | ARM7 |








