LPC2888FET180/D1 by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	LPC2888FET180/D1
Description	MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet	LPC2888FET180/D1 Datasheet
In Stock	1,616

NAME	DESCRIPTION
Minimum Supply Voltage:	1.7 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.8 V
Maximum Seated Height:	1.11 mm
Sub-Category:	Microcontrollers
Surface Mount:	YES
ADC Channels:	YES
No. of Terminals:	180
DMA Channels:	YES
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
No. of I/O Lines:	85
Address Bus Width:	21
Technology:	CMOS
JESD-30 Code:	S-PBGA-B180
Maximum Clock Frequency:	20 MHz
Package Shape:	SQUARE
ROM Words:	1048576
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	10 mm
Moisture Sensitivity Level (MSL):	3
Speed:	60 rpm
Peripheral IC Type:	MICROCONTROLLER, RISC
Maximum Supply Voltage:	1.95 V
RAM Bytes:	65536
External Data Bus Width:	16
Bit Size:	32
DAC Channels:	YES
Minimum Operating Temperature:	-40 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA180,18X18,20
Length:	10 mm
PWM Channels:	NO
Additional Features:	ALSO REQUIRES 3.3V SUPPLY
ROM Programmability:	FLASH
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.8,3.3
CPU Family:	ARM7

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,616	-	-

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