NXP Semiconductors - LPC3130FET180

LPC3130FET180 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC3130FET180
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 180; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet LPC3130FET180 Datasheet
In Stock2,285
NAME DESCRIPTION
Minimum Supply Voltage: 1 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.2 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
ADC Channels: YES
No. of Terminals: 180
DMA Channels: YES
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
No. of I/O Lines: 0
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B180
Maximum Clock Frequency: 25 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Speed: 180 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 1.3 V
External Data Bus Width: 0
Bit Size: 32
DAC Channels: NO
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Length: 12 mm
PWM Channels: YES
Additional Features: ALSO REQUIRES 1.8V OR 3.3V SUPPLY
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
2,285 $4.500 $10,282.500

Popular Products

Category Top Products