NXP Semiconductors - LPC5528JBD100K

LPC5528JBD100K by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC5528JBD100K
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: HLFQFP; Package Shape: SQUARE;
Datasheet LPC5528JBD100K Datasheet
In Stock8,076
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Seated Height: 1.6 mm
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 100
DMA Channels: YES
Terminal Position: QUAD
Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
No. of I/O Lines: 64
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PQFP-G100
Maximum Clock Frequency: 32 MHz
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 105 Cel
Package Code: HLFQFP
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Speed: 150 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
External Data Bus Width: 0
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Length: 14 mm
PWM Channels: YES
On Chip Program ROM Width: 8
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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