NXP Semiconductors - LPC812M101FDH16

LPC812M101FDH16 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC812M101FDH16
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet LPC812M101FDH16 Datasheet
In Stock2,508
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 1.1 mm
Surface Mount: YES
ADC Channels: NO
No. of Terminals: 16
DMA Channels: NO
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
No. of I/O Lines: 14
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: R-PDSO-G16
Maximum Clock Frequency: 25 MHz
Package Shape: RECTANGULAR
ROM Words: 16384
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 1
Data EEPROM Size: 0
Speed: 30 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 4096
External Data Bus Width: 0
Peripherals: BOD, COMPARATOR, CRC, PMU, POR, TIMER(5), WDT
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Length: 5 mm
PWM Channels: NO
On Chip Program ROM Width: 8
Connectivity: I2C, SPI(2), USART(2)
ROM Programmability: FLASH
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
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