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Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | LPC812M101JTB16 |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVSON; Package Shape: RECTANGULAR; |
Datasheet | LPC812M101JTB16 Datasheet |
In Stock | 3,032 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.8 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | NO |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
On Chip Data RAM Width: | 8 |
Technology: | CMOS |
Maximum Clock Frequency: | 25 MHz |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Package Code: | HVSON |
Moisture Sensitivity Level (MSL): | 1 |
No. of External Interrupts: | 8 |
Bit Size: | 32 |
DAC Channels: | NO |
Qualification: | Not Qualified |
Package Equivalence Code: | SOLCC16,.1,16 |
PWM Channels: | YES |
Connectivity: | I2C, SPI(2), UART |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | .4 mm |
CPU Family: | CORTEX-M0 |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | .5 mm |
Maximum Supply Current: | 100 mA |
ADC Channels: | NO |
No. of Terminals: | 16 |
No. of Timers: | 7 |
DMA Channels: | NO |
Terminal Position: | DUAL |
Format: | FIXED POINT |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
No. of I/O Lines: | 14 |
JESD-30 Code: | R-PDSO-N16 |
ROM Words: | 16384 |
Maximum Operating Temperature: | 105 Cel |
Width: | 2.5 mm |
Speed: | 30 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 4096 |
Low Power Mode: | YES |
Boundary Scan: | YES |
Peripherals: | BOD, COMPARATOR, POR, TIMER(4), WDT |
Minimum Operating Temperature: | -40 Cel |
Length: | 3.2 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |