NXP Semiconductors - LPC832M101FDH20FP

LPC832M101FDH20FP by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC832M101FDH20FP
Description MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; ROM Programmability: FLASH;
Datasheet LPC832M101FDH20FP Datasheet
In Stock3,486
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Nominal Supply Voltage: 3.3 V
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 20
DMA Channels: YES
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
No. of I/O Lines: 16
Address Bus Width: 0
Maximum Clock Frequency: 25 MHz
Package Shape: RECTANGULAR
ROM Words: 16384
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 1
Data EEPROM Size: 0
Speed: 30 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 4096
External Data Bus Width: 0
Peripherals: BOD, DMA(18), POR, RTC, TIMER(7), WDT
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Length: 6.5 mm
PWM Channels: YES
On Chip Program ROM Width: 8
Connectivity: I2C, SPI(2), USART
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Analog To Digital Convertors: 5-Ch 12-Bit
Terminal Pitch: .65 mm
CPU Family: CORTEX-M0+
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Pricing (USD)

Qty. Unit Price Ext. Price
3,486 $0.968 $3,374.448

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