NXP Semiconductors - LS1023AXE7QQB

LS1023AXE7QQB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LS1023AXE7QQB
Description SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;
Datasheet LS1023AXE7QQB Datasheet
In Stock2,310
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Nominal Supply Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: 1.03 V
Maximum Seated Height: 2.07 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 621
Package Equivalence Code: BGA621,25X25,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 21 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B621
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 250
Package Code: FBGA
Width: 21 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
2,310 $71.470 $165,095.700

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