LS1043ACE9MQB by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	LS1043ACE9MQB
Description	SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;
Datasheet	LS1043ACE9MQB Datasheet
In Stock	1,399

NAME	DESCRIPTION
Minimum Supply Voltage:	.87 V
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	SYSTEM ON CHIP
Nominal Supply Voltage:	.9 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Supply Voltage:	.93 V
Maximum Seated Height:	2.07 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
JESD-609 Code:	e1
No. of Terminals:	780
Package Equivalence Code:	BGA780,28X28,32
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Length:	23 mm
Technology:	CMOS
JESD-30 Code:	S-PBGA-B780
Package Shape:	SQUARE
Terminal Form:	BALL
Peak Reflow Temperature (C):	250
Package Code:	HFBGA
Width:	23 mm
Terminal Pitch:	.8 mm
Moisture Sensitivity Level (MSL):	3

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,399	-	-

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