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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | LS1046ASE8Q1A |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780; |
| Datasheet | LS1046ASE8Q1A Datasheet |
| In Stock | 258 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 935313306557 |
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 64 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.07 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Terminals: | 780 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 23 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B780 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 250 |
| Package Code: | HBGA |
| Width: | 23 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
