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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | LS1046ASE8Q1A |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780; |
Datasheet | LS1046ASE8Q1A Datasheet |
In Stock | 258 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Speed: | 64 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2.07 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
No. of Terminals: | 780 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Length: | 23 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B780 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 250 |
Package Code: | HBGA |
Width: | 23 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |