LS1046AXE8Q1A by NXP Semiconductors | Peripheral ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	LS1046AXE8Q1A
Description	SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
Datasheet	LS1046AXE8Q1A Datasheet
In Stock	272

NAME	DESCRIPTION
Minimum Supply Voltage:	.97 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2.61 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	780
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-PBGA-B780
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	FBGA
Width:	23 mm
Moisture Sensitivity Level (MSL):	3
Peripheral IC Type:	SoC
Maximum Supply Voltage:	1.03 V
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Package Equivalence Code:	BGA780,28X28,32
Length:	23 mm
Peak Reflow Temperature (C):	250
Terminal Pitch:	.8 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
272	-	-

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Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;