Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC06XSD200FKR2 |
| Description | Peripheral Drivers; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; |
| In Stock | 3,359 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Driver No. of Bits: | 2 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Output Current: | .0022 A |
| Sub-Category: | Peripheral Drivers |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 23 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC23(UNSPEC) |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Technology: | BICMOS |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | QCCN |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 3.3/5 |
| Moisture Sensitivity Level (MSL): | 3 |
