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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MC12311CHNR |
Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 60; Package Code: LGA; Package Shape: SQUARE; |
In Stock | 2,724 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Telecom IC Type: | TELECOM CIRCUIT |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | NICKEL GOLD |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 60 |
Qualification: | Not Qualified |
Package Equivalence Code: | LGA60,16X16,20 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-N60 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | LGA |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2/3.3 |
Moisture Sensitivity Level (MSL): | 3 |