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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC13055P |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | MC13055P Datasheet |
| In Stock | 4,932 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 4.4 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Package Equivalence Code: | DIP16,.3 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Length: | 19.175 mm |
| JESD-30 Code: | R-PDIP-T16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | INDUSTRIAL |
