NXP Semiconductors - MC13111AFTA

  1. Home
  2. NXP Semiconductors - MC13111AFTA
MC13111AFTA by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MC13111AFTA
Description CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
Datasheet MC13111AFTA Datasheet
In Stock338
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.6 V
Telecom IC Type: CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Maximum Supply Current: 10.5 mA
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 48
Package Equivalence Code: QFP48,.35SQ,20
Terminal Position: QUAD
Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH
Length: 7 mm
JESD-30 Code: S-PQFP-G48
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LFQFP
Width: 7 mm
Terminal Pitch: .5 mm
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
338 - -

Popular Products

Category Top Products

TEA1118TD by NXP Semiconductors

TEA1118TD

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
UAA2078M-T by NXP Semiconductors

UAA2078M-T

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
SC14CVMDECTSF02T by Renesas Electronics

SC14CVMDECTSF02T

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3;
TG2403CT by Toshiba

TG2403CT

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 20; Package Code: HVBCC; Package Shape: RECTANGULAR;
CGY2032TS-T by NXP Semiconductors

CGY2032TS-T

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
PCD5041HZ-T by NXP Semiconductors

PCD5041HZ-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;
UAA2068G by NXP Semiconductors

UAA2068G

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;
953220650512 by NXP Semiconductors

953220650512

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TA7761P by Toshiba

TA7761P

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SC14434A4M100VV by Renesas Electronics

SC14434A4M100VV

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT;
LMX3161VBHX by Texas Instruments

LMX3161VBHX

Texas Instruments

LMX3161VBHX by Texas Instruments is a Cordless Phone IC with 48 terminals, BICMOS technology, and 3.6V supply voltage. It is designed for cordless telephone support circuits, operates b/w -10 to 70°C, and features a low-profile flatpack package style.
PCA5097H-T by NXP Semiconductors

PCA5097H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; JESD-30 Code: R-PQFP-G100;
CT914B by NXP Semiconductors

CT914B

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Surface Mount: NO; Package Body Material: UNSPECIFIED;
MC13158FTB by NXP Semiconductors

MC13158FTB

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
SC14CVMDECTSF02T by Dialog Semiconductor

SC14CVMDECTSF02T

Dialog Semiconductor

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT;
ST25R3916B-AQWT by STMicroelectronics

ST25R3916B-AQWT

STMicroelectronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
PCD50922H-T by NXP Semiconductors

PCD50922H-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
TA31101AF-TP2 by Toshiba

TA31101AF-TP2

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD5043H-T by NXP Semiconductors

PCD5043H-T

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;
S1A0429A01-S0BA by Samsung

S1A0429A01-S0BA

Samsung

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;