MC13156DW by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC13156DW
Description	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet	MC13156DW Datasheet
In Stock	4,796

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Telecom IC Type:	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Maximum Seated Height:	2.65 mm
Surface Mount:	YES
Maximum Supply Current:	8 mA
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	24
Package Equivalence Code:	SOP24,.4
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
Length:	15.395 mm
Technology:	BIPOLAR
JESD-30 Code:	R-PDSO-G24
Package Shape:	RECTANGULAR
Nominal Negative Supply Voltage:	-3 V
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	SOP
Width:	7.5 mm
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL

Pricing (USD)

Qty.	Unit Price	Ext. Price
4,796	-	-

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