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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC13760 |
| Description | RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 104; Package Code: LFBGA; Package Shape: RECTANGULAR; |
| Datasheet | MC13760 Datasheet |
| In Stock | 4,616 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | 1.6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 104 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 10 mm |
| JESD-30 Code: | R-PBGA-B104 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 10 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
