MC13892DJVLR2 by NXP Semiconductors | Other Function Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC13892DJVLR2
Description	POWER SUPPLY MANAGEMENT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 186; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
In Stock	1,495

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	40
Width (mm):	12 mm
Maximum Seated Height:	1.6 mm
Minimum Supply Voltage (Vsup):	1.8 V
Maximum Supply Current (Isup):	1.5 mA
Sub-Category:	Power Management Circuits
Surface Mount:	YES
Terminal Finish:	TIN SILVER
No. of Terminals:	186
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
JESD-30 Code:	S-PBGA-B186
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
No. of Channels:	1
Package Code:	LFBGA
Nominal Supply Voltage (Vsup):	3.6 V
Moisture Sensitivity Level (MSL):	3
JESD-609 Code:	e2
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA186,14X14,32
Other IC type:	POWER SUPPLY MANAGEMENT CIRCUIT
Length:	12 mm
Adjustable Threshold:	YES
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	3.6

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,495	-	-

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