NXP Semiconductors - MC15XS3400DHFKR2

MC15XS3400DHFKR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC15XS3400DHFKR2
Description BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: BUTT; No. of Terminals: 24; Package Code: HBCC; Package Shape: SQUARE;
Datasheet MC15XS3400DHFKR2 Datasheet
In Stock4,923
NAME DESCRIPTION
Minimum Supply Voltage: 6 V
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 12 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 2.2 mm
Sub-Category: Peripheral Drivers
Surface Mount: YES
No. of Terminals: 24
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG
JESD-30 Code: S-XBCC-B24
Package Shape: SQUARE
Terminal Form: BUTT
Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Maximum Operating Temperature: 125 Cel
Package Code: HBCC
Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Width: 12 mm
Turn-off Time: 90 us
Moisture Sensitivity Level (MSL): 3
Driver No. of Bits: 4
Maximum Supply Voltage: 20 V
Turn-on Time: 90 us
Minimum Operating Temperature: -40 Cel
No. of Functions: 4
Qualification: Not Qualified
Package Equivalence Code: LCC24(UNSPEC)
Output Current Flow Direction: SINK
Length: 12 mm
Additional Features: ALSO OPERATES WITH 4 TO 28 VOLTS
Peak Reflow Temperature (C): 260
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3/5
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