NXP Semiconductors - MC16XSD200FK

MC16XSD200FK by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC16XSD200FK
Description BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: QCCN; Package Equivalence Code: LCC23(UNSPEC);
Datasheet MC16XSD200FK Datasheet
In Stock499
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Driver No. of Bits: 2
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Peripheral Drivers
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 23
Qualification: Not Qualified
Package Equivalence Code: LCC23(UNSPEC)
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: BICMOS
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: QCCN
Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 3.3/5,8/36
Moisture Sensitivity Level (MSL): 3
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Pricing (USD)

Qty. Unit Price Ext. Price
499 - -

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