MC33218AP by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	MC33218AP
Description	SPEAKER PHONE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet	MC33218AP Datasheet
In Stock	2,329

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Maximum Seated Height:	4.44 mm
Sub-Category:	Telephone Circuits
Surface Mount:	NO
Maximum Supply Current:	6 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	24
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	BIPOLAR
JESD-30 Code:	R-PDIP-T24
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Maximum Operating Temperature:	85 Cel
Package Code:	DIP
Width:	7.62 mm
Telecom IC Type:	SPEAKER PHONE CIRCUIT
JESD-609 Code:	e0
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	DIP24,.3
Length:	31.69 mm
Terminal Pitch:	2.54 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	5

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,329	$2.470	$5,752.630

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