NXP Semiconductors - MC33219AP

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MC33219AP by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC33219AP
Description SPEAKER PHONE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet MC33219AP Datasheet
In Stock1,360
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Telecom IC Type: SPEAKER PHONE CIRCUIT
Maximum Seated Height: 4.44 mm
Surface Mount: NO
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 24
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 31.69 mm
JESD-30 Code: R-PDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Width: 7.62 mm
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
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