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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MC33664ATL1EGR2 |
| Description | INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; |
| Datasheet | MC33664ATL1EGR2 Datasheet |
| In Stock | 3,334 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
568-MC33664ATL1EGR2TR 935323606518 568-MC33664ATL1EGR2CT MC33664ATL1EGR2-ND 568-MC33664ATL1EGR2DKR |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | INTERFACE CIRCUIT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Moisture Sensitivity Level (MSL): | 3 |









